Diamond Industry Value Chain To Be Fully Showcased At FINE2026 Shanghai

On June 10, 2026, the 2026 Future Industry New Materials Expo (FINE2026) opened at the Shanghai New International Expo Centre. Formed through the integration and upgrading of three specialized exhibitions, the event covers an area of ​​40,000 square meters. Aligned with the "15th Five-Year Plan" for future industry development, it focuses on sectors such as advanced semiconductors, thermal management, and advanced batteries, serving as a platform for industry-academia-research collaboration and fostering the growth of "new quality productive forces."

At the opening ceremony, representatives from industry associations and enterprises emphasized that new materials form the core foundation of future industries; the expo facilitates the commercialization of technologies and helps the industry seize market opportunities. The exhibition features two core zones: the Advanced Semiconductor Zone (N1) and the AI ​​Chip Thermal Management Zone (N2), with diamond-renowned for its exceptional properties like ultra-high thermal conductivity and wide bandgap-serving as a major highlight.

Over a hundred diamond enterprises and research institutions from across the country gathered to showcase a complete industry chain, ranging from diamond single crystals, substrates, and heat dissipation devices to growth and precision processing equipment. These exhibits illustrate the material's evolution from a traditional superhard material into a functional material for semiconductors and thermal management. Industry leaders such as Zhongnan Diamond and Ningbo Jingzuan displayed high-end products like semiconductor-grade diamond wafers and CVD heat spreaders, while thermal management companies introduced diamond composite heat dissipation substrates designed to solve cooling challenges for high-power AI chips. Additionally, a comprehensive suite of domestically produced processing equipment-including MPCVD systems, laser cutting tools, and ultra-precision polishing machines-was showcased, highlighting the independent R&D capabilities of China's diamond industry chain.

 

The expo featured a series of professional forums covering topics such as diamond technology frontiers, third- and fourth-generation semiconductors, and chip thermal management, where industry experts discussed future technological directions. Emphasizing the integration of industry, academia, research, and finance, the event hosted over 5,000 invited investment institutions and end-user buyers. Concurrent activities-including research roadshows, investment matchmaking sessions, and new product launches-were organized to accelerate the industrialization and commercial application of new material innovations.