A New Patent For Diamond Copper Composite Material

A new patent for diamond copper composite material

 

According to the information of the China National Intellectual Property Administration, Guangzhou Zhongshan Additive Technology Co., Ltd. applied for a patent entitled "a copper alloy powder and its method of grafting 3D printing on diamond copper composites", with the publication number of CN 120555820 A and the application date of July 2025.

 

 

The patent abstract shows that the present invention discloses a copper alloy powder and a method for grafting 3D printing it on diamond copper composite materials. The present invention generates stable carbides (such as TiC, Cr3C2, etc.) by adding highly active elements such as Cr and Ti to copper, forming chemical bonds at the interface between copper alloy and diamond, significantly reducing interface energy, and thereby improving wettability; The addition of element B can not only improve product performance, but also compensate for the decrease in thermal conductivity caused by the addition of impurity elements in non copper metals, and reduce the thermal conductivity loss of the grafting part due to the addition of impurities. The copper alloy powder of the present invention is particularly suitable for grafting 3D printing on diamond copper composite materials with a diamond copper mixed surface to obtain products with excellent heat transfer performance, such as for 3D printing liquid cooled heat dissipation devices.

 

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