Sintered-electroplated Diamond Blade

Sintered-electroplated Diamond Blade

This is a diamond saw blade manufactured using a dual process of sintered diamond technology and electroplated diamond technology. At the same time, it can meet the dual functions of cutting and grinding. Common sizes include 115/125/180/230 diameter
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Products Description

product-638-351

The saw blade adopts sintered diamond technology and adopts a turbo-diamond-segment structure. It can meet the dry cutting needs of most scenarios. At the same time, electroplating diamond technology is used on the substrate(steel body) of the saw blade, which electroplating a large number of triangular diamond abrasive areas, making the saw blade not only capable of strong cutting, but also capable of grinding processing. This greatly improves work efficiency

product-416-218

Sintered diamond saw blade teeth

 

product-486-285

Electroplated diamond on the face of steel body

 

Specifications and Dimensions

Diameter Thread Thickness Application
115 22.23/M14 1.2 Professional cutting and grinding of glass materials, ceramic materials, stone materials, semiconductor materials, etc.
125 1.2
180 1.6
230 1.8

* Regular size with flange;
* Only a small amount of inventory;
* Customizable size according to user needs.

product-338-364

 

Products Description

Product Outer box dimensions Quantity
Φ115*M14 40*21*28 50pcs/carton
Φ125*M14 40*21*28 50pcs/carton
Φ180*M14 38*19*30 25pcs/carton
Φ230*M14 49*25*35 25pcs/carton

* For more packaging details and packaging weight, please contact our customer service personnel to request;

* We will supply you the latest shipping fees for your reference.

product-424-558

Single blade white logo free cardboard box packaging.
Thickened corrugated cardboard boxes are used for packaging.

 

cutting-grinding-saw-blade2

product-270-235

Sintered & Electroplated "Starry Sky" Diamond Saw Blades - Diameters: 115, 125, 180, 230 mm; Bore Size: 22.23 mm

 

Electroplated diamond saw blades are manufactured using an electrochemical process. The working layer of the blade contains diamond abrasive grains, which are bonded to the blade substrate by a metal matrix. The process begins with the deposition of a metal bond layer covering approximately 20% of the diamond grain height (known as "grain setting"); subsequently, additional metal bond material is applied to further secure the grains (known as "thickening"), bringing the total bond coverage to approximately two-thirds of the grain height. These blades are professionally designed for cutting and grinding a wide range of materials, including glass, ceramics, stone, and semiconductors. Characterized by high cutting efficiency, low noise levels, chip-free cutting (no edge chipping), stability, and resistance to deformation, they offer flexible application and stand as one of the most common tools for cutting and grinding brittle, non-metallic materials.

 

This series of electroplated products is suitable for use with handheld equipment, such as manual cutters, pneumatic cutting tools, and angle grinders.

 

Manufactured by Huicetools, this saw blade model delivers stable performance and exceptional value for money, offered via direct-from-factory sales. For further information or to inquire about our latest promotional pricing, please contact our customer service team.

Hot Tags: sintered-electroplated diamond blade, China sintered-electroplated diamond blade manufacturers

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