Diamond Based Heat Dissipation Packaging Materials Seminar Held in Xuchang

To promote technological innovation and industrial application of diamond based heat dissipation packaging materials and devices, a seminar on diamond based heat dissipation packaging materials and devices was grandly held in Xuchang on July 25th. The seminar was hosted by Xuchang Industry and Information Technology Bureau, Science and Technology Bureau, and Xuchang Investment Group Co., Ltd., and organized by Henan Huanghe Whirlwind Co., Ltd., Suzhou Bozhi Gold Diamond Technology Co., Ltd., and Henan Qianyuan Core Diamond Semiconductor Technology Co., Ltd. The seminar brought together many experts, scholars, and enterprise representatives in the industry to engage in in-depth dialogue and cooperation on cutting-edge technologies, development trends, and market applications in the field of diamond based heat dissipation packaging materials and devices, and jointly draw a blueprint for the diamond heat dissipation industry.

Yue Bangkui, Deputy Mayor of Xuchang City, attended the meeting and delivered a speech. He emphasized that diamond based heat dissipation packaging materials, as emerging key materials, have broad application prospects in multiple fields such as electronics, communication, and energy. Xuchang has a solid foundation in the superhard materials industry, especially in the field of diamond materials, with strong industrial advantages and technological strength. The convening of this seminar is of great significance for Xuchang to further consolidate and enhance its position in the superhard materials industry, and promote industrial upgrading and transformation. At the same time, it is also hoped that through this conference, more high-quality resources can be attracted, the deep integration of industry, academia, research and application can be strengthened, technical difficulties can be overcome together, and the high-quality development of the diamond based heat dissipation packaging materials and device industry can be promoted.

 

During the technical seminar, Associate Professor Wang Yanfeng, doctoral supervisor at Xi'an Jiaotong University, Dr. Zhang Yongjian from Beijing University of Science and Technology, Senior Engineer Nie Yuan from Chengdu Hongke Electronic Technology Co., Ltd., and Professor Ma Shenglin from Xiamen University delivered a series of exciting presentations. Experts point out that diamond, as a material with extremely high thermal conductivity, good electrical insulation, and low thermal expansion coefficient, has great potential in solving the heat dissipation problem of high-power electronic devices. At present, the continuous advancement of synthesis technologies such as chemical vapor deposition (CVD) has provided the possibility for the preparation of large-sized and high-quality diamond heat dissipation materials. In the report, experts shared their latest research achievements and practical experience in related fields, bringing cutting-edge technological information and innovative ideas to the participants.

 

During the new product launch event, Tan Zongwu, Deputy Director of Xuchang Industry and Information Technology Bureau, He Wei, Deputy Director of Xuchang Science and Technology Bureau, Yang Zengjun, Chairman of Xuchang Investment Group Co., Ltd., Li Ge, Chairman and General Manager of Henan Huanghe Cyclone Co., Ltd., and Pan Yuanzhi, General Manager of Suzhou Bozhi Diamond Technology Co., Ltd. jointly unveiled the new product.

 

Pang Wenlong, General Manager of Huanghe Cyclone, shared and introduced the development project of CVD polycrystalline diamond film and large-sized wafers for high-end application scenarios; Pan Yuanzhi, General Manager of Bozhi Diamond, introduced the research progress, technological breakthroughs, and application scenarios of diamond based semiconductor products.

 

It is reported that the Qianyuan Core Diamond, a joint venture between Huanghe Whirlwind and Bozhi Diamond, brings a series of innovative products such as 6-inch and 8-inch MPCVD polycrystalline diamond wafers, single polycrystalline diamond packaging carriers, ultra-thin diamond thin film devices, and ultra-thin diamond heat sinks. Among them, diamond based heat dissipation packaging carriers have overcome technical challenges such as large-scale substrate growth, surface treatment, and precision thin films, and have achieved the engineering application of high-power chips and devices.

 

The successful holding of this seminar on diamond based heat dissipation packaging materials and devices has provided a good platform for industry professionals to exchange and cooperate, promoting the sharing of technical information and the integration of industrial resources. Through in-depth technical discussions and the release of new products, the development direction of diamond based heat dissipation packaging materials and devices has been further clarified, which plays a positive role in promoting technological innovation and industrial development in this field. I believe that with the joint efforts of all parties, the diamond based heat dissipation packaging materials and device industry will usher in a broader development prospect.