HUANGHE WHIRLWIND Releases New Diamond Products That Will Lead The Development Of Semiconductor Materials

Recently, at the "Carbon Future" Diamond based Heat Dissipation Packaging Materials and Devices Seminar held in Xuchang, Henan Province, the four types of diamond new products launched by Henan Qianyuan Core Diamond Semiconductor Technology Co., Ltd. became the focus of the industry. These products are expected to provide innovative solutions for the heat dissipation problems in fields such as 5G/6G and AI chips, helping China's high-end semiconductor materials industry move from "following" to "leading".

 

1, Four new products directly targeting high-end heat dissipation needs

The four major categories of products released by Henan Qianyuan Xindian Semiconductor Technology Co., Ltd. this time are: ultra-thin diamond heat sinks, ultra-thin diamond thin film devices, single/polycrystalline diamond packaging carriers, and modified diamond powders and diamond copper composite materials. These products precisely target the high-end cooling needs of strategic emerging industries such as artificial intelligence, new energy, optical communication, and data centers, and have broad market prospects.

 

2, The joint venture has a strong background and remarkable research and development achievements

Henan Qianyuan Xindian Semiconductor Technology Co., Ltd. was jointly established by HENAN HUANGHE WHIRLWIND CO.,LTD. and Suzhou Bozhi Jindian Technology Co., Ltd. As the only domestic enterprise in the entire industry chain of superhard materials, Huanghe Whirlwind has achieved fruitful results in the research and development of diamond materials. In May 2023, the Yellow River Cyclone launched the "Development of CVD Polycrystalline Diamond Thin Films for High end Application Scenarios" project, successfully developing a 2-inch diameter CVD polycrystalline diamond heat sink. On November 11, 2024, the Yellow River Cyclone and Xiamen University's Sa Ben Dong Micro Nano Science and Technology Research Institute established a joint laboratory for integrated circuit thermal control to carry out innovative research on integrated heat dissipation applications based on diamond materials, targeting the heat dissipation problems of chips in the fields of 5G/6G, AI, and phased array radar. At the beginning of 2025, the Yellow River Cyclone successfully grew a 5-30 μ m ultra-thin 6-8 inch polycrystalline diamond wafer heat sink material for semiconductors. The material has a thickness of 0.02-1mm, good uniformity, and a thermal conductivity of 1000-2200W/m • K. The key indicators meet customer needs and mass production standards. Currently, we are actively connecting with downstream high-end application fields and exploring the market.

 

The Yellow River Whirlwind, combined with Bozhi Gold Diamond's technical experience in the field of high-power chip packaging devices, especially advanced surface modification technology, jointly promotes the research and industrialization of multiple new generation ultra-high performance diamond heat dissipation materials and devices, further improving the heat transfer and electrical performance of packaging devices, and leading the development direction of international ultra-high power heat dissipation materials and devices.

 

 

3, Experts and scholars gather to explore cutting-edge achievements together

At the seminar, experts and scholars from universities such as Xi'an Jiaotong University and Beijing University of Science and Technology shared their latest research findings. Dr. Wang Yanfeng, Associate Professor at Xi'an Jiaotong University, presented a report on "Single Crystal Diamond Ultra Wide Bandgap Semiconductor" based on his research on diamond semiconductors in terms of bandgap width, breakdown field strength, mobility, dielectric constant, thermal conductivity, etc; Dr. Zhang Yongjian from the National Key Laboratory of New Metal Materials at Beijing University of Science and Technology presented a report titled "Research on Interface Control and Preparation of High Thermal Conductivity Copper/Diamond Composite Materials"; Nie Yuan, a senior engineer at Chengdu Hongke Electronic Technology Co., Ltd., delivered a report on the thermal application and market research of diamonds; Dr. Ma Shenglin, Deputy Director, Professor, and Doctoral Supervisor of the Department of Mechanical and Electrical Engineering at Xiamen University, gave a report on the application of diamond in heat dissipation of high computing power Ai chip packaging. He provided a detailed introduction to the integrated application design of diamond in heat dissipation of high computing power Ai chip packaging, as well as the research progress in diamond jet microfluidic heat dissipation.

 

4, Looking ahead to the future, leading the high-quality development of the industry

Pang Wenlong, Vice Chairman and General Manager of Huanghe Cyclone, stated that Huanghe Cyclone will take this seminar as an opportunity to strengthen cooperation with multiple parties and continue to promote the research and development of polycrystalline diamond wafers. Key breakthroughs include the preparation technology of 12 inch polycrystalline diamond wafer heat sink materials, and the development of large-sized colorless polycrystalline diamond wafers for high-end applications such as optical windows. Driven by technological breakthroughs, leading the high-quality development of the industry, and providing world leading heat dissipation solutions for China's semiconductor industry.